BYD's In-House BMS Chips Gain Traction Among Major Chinese Carmakers, Driving Annual Shipments to New Heights

Deep News07-09 19:41

On July 9th, BYD Company Limited (SZ: 002594) released an investor relations activity summary. The company outlined its semiconductor business, emphasizing its role as a power semiconductor IDM (Integrated Device Manufacturer). BYD's semiconductor division possesses comprehensive capabilities spanning chip design, wafer fabrication, and packaging and testing, positioning it as the largest automotive-grade chip enterprise in China.

The company independently develops a wide range of automotive-grade semiconductor products, including high-performance central processing chips, power chips, driver chips, image and radar sensor chips, connectivity chips, security chips, and power management chips. Within the domestic Battery Management System (BMS) sector, BYD Semiconductor is noted as the exclusive provider of a complete chip solution.

Several of its BMS chips have successfully entered the supply chains of multiple leading domestic automotive manufacturers and have achieved mass production. Consequently, annual shipment volumes have consistently reached new record highs.

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Comments

We need your insight to fill this gap

Leave a comment

{"i18n":{"language":"en_US"},"isChannel":false,"data":{"share":"https://ttm.financial/m/news/1146430405?lang=en_US&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2026-07-09 19:41","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"1146430405","market":"sg","top_or_hot":-1,"title":"BYD's In-House BMS Chips Gain Traction Among Major Chinese Carmakers, Driving Annual Shipments to New Heights","media":"Deep News","content":"<p>On July 9th, <b>BYD Company Limited</b> (SZ: 002594) released an investor relations activity summary. The company outlined its semiconductor business, emphasizing its role as a power semiconductor IDM (Integrated Device Manufacturer). <b>BYD</b>'s semiconductor division possesses comprehensive capabilities spanning chip design, wafer fabrication, and packaging and testing, positioning it as the largest automotive-grade chip enterprise in China.<br><br>The company independently develops a wide range of automotive-grade semiconductor products, including high-performance central processing chips, power chips, driver chips, image and radar sensor chips, connectivity chips, security chips, and power management chips. Within the domestic Battery Management System (BMS) sector, <b>BYD</b> Semiconductor is noted as the exclusive provider of a complete chip solution.<br><br>Several of its BMS chips have successfully entered the supply chains of multiple leading domestic automotive manufacturers and have achieved mass production. Consequently, annual shipment volumes have consistently reached new record highs.<br><br></p>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>BYD's In-House BMS Chips Gain Traction Among Major Chinese Carmakers, Driving Annual Shipments to New Heights</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nBYD's In-House BMS Chips Gain Traction Among Major Chinese Carmakers, Driving Annual Shipments to New Heights\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1039043262\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/8296859682db4b478146245e72de1922);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Deep News </p>\n<p class=\"h-time\">2026-07-09 19:41</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<p>On July 9th, <b>BYD Company Limited</b> (SZ: 002594) released an investor relations activity summary. The company outlined its semiconductor business, emphasizing its role as a power semiconductor IDM (Integrated Device Manufacturer). <b>BYD</b>'s semiconductor division possesses comprehensive capabilities spanning chip design, wafer fabrication, and packaging and testing, positioning it as the largest automotive-grade chip enterprise in China.<br><br>The company independently develops a wide range of automotive-grade semiconductor products, including high-performance central processing chips, power chips, driver chips, image and radar sensor chips, connectivity chips, security chips, and power management chips. Within the domestic Battery Management System (BMS) sector, <b>BYD</b> Semiconductor is noted as the exclusive provider of a complete chip solution.<br><br>Several of its BMS chips have successfully entered the supply chains of multiple leading domestic automotive manufacturers and have achieved mass production. Consequently, annual shipment volumes have consistently reached new record highs.<br><br></p>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1861219969.SGD","symbol_name":"Blackrock Future of Transport A2 SGD-H","start_time":0,"source_url":"","article_id":"1146430405","we_media_id":"1039043262","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=1146430405","pubTimestamp":1783597283,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Deep News","introduction":"Global Stock Market Deep Analysis","home_visible":1,"id":"1039043262","head_image":"https://community-static.tradeup.com/news/8296859682db4b478146245e72de1922"},"summary":"On July 9th, BYD Company Limited (SZ: 002594) released an investor relations activity summary. The company outlined its semiconductor business, emphasizing its role as a power semiconductor IDM...","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"LU1861219969.SGD":"Blackrock Future of Transport A2 SGD-H","002594":"比亚迪","LU0683595622.HKD":"AB SICAV I-EM.MKTS MUL.ASS.PTF(AD)","BK0183":"MSCI概念","LU2580892789.USD":"FRANKLIN SEALAND CHINA A-SHARES \"A\" (USD) ACC","LU0633140727.USD":"AB EMERGING MARKETS MULTI ASSET PORTFOLIO \"AD\" (USD) INC","BK0188":"融资融券","BK0072":"苹果","LU1781817850.SGD":"Blackrock Systematic China A-Share Opportunities A2 SGD-H","EVS.SI":"MSCI China Electric Vehicles and Future Mobility ETF-NikkoAM","LU2360107325.USD":"BGF FUTURE OF TRANSPORT \"A4\" (USD) INC","LU2328871848.SGD":"Eastspring Investments - China A Shares Growth AS SGD","01211":"比亚迪股份","LU1997245094.SGD":"安联神州A股基金AT Acc SGD","BK0155":"锂电池","LU2580892862.HKD":"FRANKLIN SEALAND CHINA A-SHARES \"A\" (HKD) ACC","LU1064131003.USD":"FULLERTON LUX FUNDS - CHINA A EQUITIES \"A\" (USD) ACC","LU2495084118.USD":"ALLIANZ CHINA A-SHARES \"ATH\" (USDHDG) ACC","LU1969619763.USD":"EASTSPRING INV CHINA A SHARES GROWTH \"A\" (USD) ACC","LU1146622755.USD":"安本中国A股股票基金A Acc","BK0014":"新能源汽车","LU1997244956.HKD":"ALLIANZ CHINA A-SHARES \"AT\" (HKD) ACC A","BK0070":"员工持股","BK0169":"共享汽车","LU2663582299.SGD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOL \"A2\" (SGDHDG) ACC","BK0196":"行业龙头","BYDDY":"比亚迪ADR","LU2148510915.USD":"FULLERTON LUX FUNDS - CHINA A EQUITIES \"R\" (USD) ACC","LU1508157978.USD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOLUTE RETURN \"A\" (USD) ACC","LU0633140560.USD":"AB EMERGING MARKET MULTI ASSET PORTFOLIO \"A\" (USD) ACC","LU1820825898.SGD":"Aberdeen Standard SICAV I - China A Share Equity A Acc SGD-H","LU1580142542.USD":"Blackrock Systematic China A-Share Opportunities A2 USD","LU2289578879.USD":"ALLIANZ CHINA A OPPORTUNITIES \"AT\" (USD) ACC","BK0264":"汽车制造","LU1861214812.USD":"Blackrock Future of Transport A2 USD","LU1064130708.USD":"FULLERTON LUX FUNDS - CHINA A EQUITIES \"I\" (USD) ACC","LU1997245177.USD":"安联神洲A股基金"},"translate_title":"比亚迪自产BMS芯片在中国主要汽车制造商中获得关注，推动年度出货量再创新高","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"01211":1,"002594":1,"EVS.SI":1,"BYDDY":1},"content_text":"On July 9th, BYD Company Limited (SZ: 002594) released an investor relations activity summary. The company outlined its semiconductor business, emphasizing its role as a power semiconductor IDM (Integrated Device Manufacturer). BYD's semiconductor division possesses comprehensive capabilities spanning chip design, wafer fabrication, and packaging and testing, positioning it as the largest automotive-grade chip enterprise in China.The company independently develops a wide range of automotive-grade semiconductor products, including high-performance central processing chips, power chips, driver chips, image and radar sensor chips, connectivity chips, security chips, and power management chips. Within the domestic Battery Management System (BMS) sector, BYD Semiconductor is noted as the exclusive provider of a complete chip solution.Several of its BMS chips have successfully entered the supply chains of multiple leading domestic automotive manufacturers and have achieved mass production. Consequently, annual shipment volumes have consistently reached new record highs.","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":true,"editions":null,"column":"","sentiment":"0","news_tag":"dataReport","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":true,"isLaohu8Offline":false,"tenantId":"TBGLOBAL","deviceId":"web-server-community-laohu8-v3","version":"4.45.2","shortVersion":"4.45.2","platform":"web","vendor":"web","appName":"ttm","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/1146430405","isCrawlerRequest":true}