高通新一代手机芯片将亮相第七届进博会

解放日报2024-10-24

  北京时间10月22日凌晨,高通在美国夏威夷发布新一代旗舰级芯片骁龙8至尊版。当晚,高通在上海宣布骁龙8至尊版将在国内智能手机及汽车上首发,并将参展第七届进博会。

  “今年进博会将是骁龙8至尊版发布后第一次在国际大型展会上亮相,我们坚信中国绝对是骁龙芯片应用最广泛的市场。”高通公司全球副总裁侯明娟告诉记者,小米、荣耀、iQOO、一加等中国品牌将在全球率先搭载最新芯片,10月底将陆续发布新款旗舰手机。

  据介绍,骁龙8至尊版包括第二代定制的高通Oryon CPU(中央处理器)、高通Adreno GPU(图形处理器)以及增强的高通Hexagon NPU(神经网络处理单元)等,将帮助智能手机实现终端侧多模态生成式AI应用。与上一代相比,骁龙8至尊版的CPU性能提升超过45%,GPU(用于游戏等运算)提升了40%,NPU(用于AI相关处理)提升了45%以上。目前,中国已发布了20多款搭载顶级骁龙旗舰芯片的商用终端。

(文章来源:解放日报)

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