$Taiwan Semiconductor Manufacturing(TSM)$
Word is that next-gen CoPoS packaging could hit mass production in the second half of 2028, targeting ultra-large AI chips beyond the current 9.5x reticle size.
Key points I'm watching:
Built for massive AI accelerators
Advanced packaging becoming just as critical as the chips themselves
Glass and ABF substrates might coexist instead of one replacing the other
NVDA's Feynman could be an early adopter, which would make this rollout more interesting.
It feels like everyone is still only talking GPUs, but the real game is quietly shifting to packaging, thermals, and substrate tech.
I'm watching this closely. These are the kinds of details that usually catch the market off guard.
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